HPC - Deep Learning - AI System

HPC - Deep Learning - AI System

Gift

System optimization service integration package

Specialized in providing powerful configuration,
acceleration for AI / Deep Learning application

Applies to the first 10 registered businesses

WORKSTATION AND HIGH PERFORMANCE SERVER

FOR EXCELLENT DEEP LEARNING HANDLING DEMAND

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VI

  • AI applications are increasingly consuming hardware resources, conventional devices are no longer capable of responding, requiring specially designed Workstation and Server configurations.
  • Comes with a large, high-speed data storage system that allows processing a variety of information according to customer requirements.
  • Ensure that AI application products are effectively deployed according to the IoT flow, helping businesses not to lag behind technology.

Pricing

Key Features

Key Features

  • Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
  • Intel® C621A Chipset
  • 16 DIMM Slots
  • Up to 4TB DRAM; 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM;
  • Intel® Optane™ Persistent Memory 200 series
  • 1 PCI-E 4.0 x8 LP,4 PCI-E 4.0 x16 (double-width) slots, 2 PCI-E 4.0 x16 (single-width) slots
  • 2 M.2 NVMe or SATA for boot drive only
  • 8x 3.5" Hot-swap drive bays
  • Up to 8 NVMe drives (4 NVMe drives supported by default)
  • 4 Removable heavy duty fans w/ Optimal Fan Speed Control
  • 2x 2200W redundant Titanium level power supplies

Pricing

Key Features

Key Features

  • Supports 3rd Gen Intel® Xeon® Scalable or Xeon® W-3300 Processors with TDP up to 270W
  • 7 PCI-E 4.0 Slots
  • 1x 10GBase-T, 1x 1GbE, and dedicated IPMI LAN ports
  • 4x 92mm hot-swap fan(s) 2x 80mm rear hot-swap exhaust PWM fan(s)
  • 2200W Redundant (1+1) Power Supplies Titanium Level Certified

Pricing

Key Features

Key Features

  • 3rd Gen Intel® Xeon® Scalable processor support
  • Intel® C621A Chipset
  • 5 PCI-E 4.0 x16, 1 PCI-E 4.0 x8, 2 NVMe M.2 slots
  • 2x 5.25" peripheral drive bays,4x internal 3.5" SATA rotating drive bays for easy access, up to 4x
  • Intel® Optane™ Persistent Memory 200 series
  • 1 PCI-E 4.0 x8 LP,4 PCI-E 4.0 x16 (double-width) slots, 2 PCI-E 4.0 x16 (single-width) slots NVMe SSD support with optional cables and converter trays
  • 1 VGA, 6 USB 3.2 Gen1 (4 Rear, 2 Front), 2 USB 3.2 Gen2 (1 Rear, 1 Front type C), 7.1 HD Audio
  • Supports up to two double width active GPUs

Pricing

Key Features

Key Features

  • 2022 Version: Supports both Intel® Xeon® W-1200/W-1300 Series and 10th/11th Generation Intel® Core™ Processors
  • 2022 Version: 2 PCI-E 4.0 x16 slots (16/NA or 8/8) M.2 Interface: 1 PCI-E 4.0x4 and 2 PCI-E 3.0 x4
  • Dual LAN ports, GbE and 2.5GbE
  • 12cm PWM quiet exhaust fan and optional 12cm front intake fan
  • 668W 80 PLUS Platinum Power Supply

XEM THÊM

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WORKSTATION

POWERFUL, SPECIALIZED CONFIGURATION

Pricing

Key Features

Key Features

  • 3rd Gen Intel® Xeon® Scalable processor support
  • Intel® C621A Chipset
  • 5 PCI-E 4.0 x16, 1 PCI-E 4.0 x8, 2 NVMe M.2 slots
  • 3x 5.25" peripheral drive bays, 8x 3.5/2.5" hot-swap SATA (default) drive bays (SAS support requires optional add-on card ), up to 4x NVMe SSD support with optional cables
  • Dual 1200W Titanium level power supplies for high powered configurations
  • 1 VGA, 6 USB 3.2 Gen1 (4 Rear, 2 Front), 1 USB 3.2 Gen2 (Rear), 7.1 HD Audio
  • Supports up to two double width active GPUs

Pricing

Key Features

Key Features

  • Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
  • Intel® C621A Chipset
  • 32 DIMM Slots
  • Up to 8TB DRAM
  • Up to 12TB Intel® Optane™ Persistent Memory; 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM;
  • Intel® Optane™ Persistent Memory 200 series
  • 10 PCI-E Gen 4.0 X16 LP Slots, 4U system with NVIDIA® HGX™ A100 4-GPU, AIOM/OCP 3.0 Support(Optional), Highest GPU communication using NVIDIA® NVLINK™, Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)
  • Flexible networking options
  • 10x 2.5" Hot-swap NVMe/SATA/SAS drive bays ,2 M.2 NVMe/SATA via Intel® C621A PCH chipset (for boot drive only)
  • 4x 3000W redundant Titanium level power supplies

Pricing

Key Features

Key Features

  • Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
  • Intel® C621A Chipset
  • 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM;
  • Intel® Optane™ Persistent Memory 200 series
  • 10 PCI-E Gen 4.0 X16 LP Slots AIOM/OCP 3.0 Support
  • Flexible networking options
  • 2 M.2 NVMe and SATA for boot drive only, 6x 2.5" Hot-swap NVMe/SATA/SAS drive bays
  • 4 heavy duty fans with optimal fan speed control
  • 4x 3000W redundant Titanium level power supplies

Pricing

Key Features

Key Features

  • Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
  • Intel® C621A Chipset
  • 32 DIMM Slots
  • Up to 8TB DRAM
  • Up to 12TB Intel® Optane™ Persistent Memory; 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM;
  • Intel® Optane™ Persistent Memory 200 series
  • 10 PCI-E Gen 4.0 X16 LP Slots, 4U system with NVIDIA® HGX™ A100 4-GPU, AIOM/OCP 3.0 Support(Optional), Highest GPU communication using NVIDIA® NVLINK™, Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)
  • Flexible networking options
  • 10x 2.5" Hot-swap NVMe/SATA/SAS drive bays ,2 M.2 NVMe/SATA via Intel® C621A PCH chipset (for boot drive only)
  • 4x 3000W redundant Titanium level power supplies

Pricing

Key Features

  • Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
  • Intel® C621A Chipset
  • 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM;
  • Intel® Optane™ Persistent Memory 200 series
  • 10 PCI-E Gen 4.0 X16 LP Slots, AIOM/OCP 3.0 Support
  • Flexible networking options
  • 2 M.2 NVMe and SATA for boot drive only, 6x 2.5" Hot-swap NVMe/SATA/SAS drive bays
  • 4 heavy duty fans with optimal fan speed control
  • 4x 3000W redundant Titanium level power supplies

Key Features

Pricing

Key Features

  • Dual Socket P+ (LGA-4189) 3rd Gen Intel® Xeon® Scalable Processors
  • Intel® C621A Chipset
  • 32 DIMM Slots; Up to 8TB DRAM; Up to 8TB Intel® Optane™ Persistent Memory (up to 12TB with DRAM); 3200/2933/2666 ECC DDR4 LRDIMM;RDIMM;
  • Intel® Optane™ Persistent Memory 200 series
  • 10 PCI-E Gen 4.0 X16 LP Slots, AIOM/OCP 3.0 Support
  • Flexible networking options
  • 2 M.2 NVMe and SATA for boot drive only, 6x 2.5" Hot-swap NVMe/SATA/SAS drive bays
  • 4 heavy duty fans with optimal fan speed control
  • 4x 3000W redundant Titanium level power supplies

Key Features

THU GỌN

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Pricing

Key Features

Key Features

  • Tower/4U Rackmount Server supporting Dual AMD EPYC™ 7001/7002-Series Processor
  • Up to 4TB ECC Registered DDR4-3200MHz RAM in 16x DIMM slots
  • 2x PCI-E 3.0 x16 slot, 3x PCI-E 3.0 x8 slot
  • 8x 3.5"Hot-swap drive bays
  • 1xM.2 NVME supported
  • Dual 10 Gigabit LAN ports
  • Integrated IPMI 2.0 and KVM with Dedicated LAN
  • 1280W Redundant Platinum Level Power Supplies

Pricing

Key Features

Key Features

  • Single AMD EPYC™ 7002/7003 Series Processor
  • 8 DIMMs; up to 2TB 3DS ECC DDR4-3200MHz RDIMM/LRDIMM
  • 5 PCI-E 4.0 x16 (FH), 2 PCI-E 4.0 x8 (FH)
  • Integrated IPMI 2.0 + KVM with dedicated LAN
  • Software Out of Band License key (SFT-OOB-LIC) included for OOB BIOS management
  • 4 internal 3.5" SATA3 drive bays and 4 internal 2.5" drive bays
  • M.2 Interface: 2 PCI-E 4.0 x4
  • M.2 Form Factor: 2280, 22110
  • M.2 Key: M-Key
  • 6 USB 3.0 ports (4 rear, 2 via header), 1 VGA, ASPEED AST2500 BMC graphics
  • Dual Gigabit LAN ports
  • 900W Gold Level Power Supply

Pricing

Key Features

Key Features

  • Tower/4U AMD Ryzen™ Threadripper™ PRO 3000WX Series Processor, up to 64 Cores
  • Up to 2TB (RDIMM) / 256GB (UDIMM), ECC/Non-ECC, Unbuffered, U-DIMM, R-DIMM, LRDIMM, and 3DS R-DIMM; 3200Mhz in 8 DIMM slots
  • 6 PCI-E 4.0 x16 slots
  • 8x 3.5"Hot-swap drive bays
  • M.2 Interface: 4 PCI-E 4.0 x4 (Software RAID 0,1,5,10)
  • M.2 Form Factor: 2280, 22110
  • M.2 Key: M-key
  • U.2 Interface: 2 U.2 sockets (Software RAID 0,1)
  • 1x 10GBase-T LAN port, 1 GbE LAN port (shared with IPMI)
  • 2000W Redundant Titanium Level Certified High-Efficiency Power Supply

Pricing

Key Features

Key Features

  • Tower/4U Dual AMD EPYC™ 7003/7002 Series Processors
  • 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs
  • 3 PCI-E 4.0 x16 slots, 3 PCI-E 4.0 x8 slots
  • 8x 3.5"Hot-swap drive bays
  • M.2 Interface: 1 PCI-E 4.0 x4
  • M.2 Form Factor: 2280, 22110
  • M.2 Key: M-key
  • Dual Gigabit LAN ports, 1 dedicated IPMI LAN Port
  • 2000W Redundant Titanium Level Certified High-Efficiency Power Supply

XEM THÊM

http://thenounproject.comThe Noun ProjectIcon TemplateRemindersStrokesTry to keep strokes at 4pxMinimum stroke weight is 2pxFor thicker strokes use even numbers: 6px, 8px etc.Remember to expand strokes before saving as an SVG SizeCannot be wider or taller than 100px (artboard size)Scale your icon to fill as much of the artboard as possibleUngroupIf your design has more than one shape, make sure to ungroupSave asSave as .SVG and make sure “Use Artboards” is checked100px.SVG

SERVER

OPTIMIZING SYSTEM PERFORMANCE

Pricing

Key Features

Key Features

  • Tower/4U Dual AMD EPYC™ 7001/7002* Series Processors
  • 4TB Registered ECC DDR4 3200MHz SDRAM in 16 DIMMs
  • 2 PCI-E 3.0 x16, 3 PCI-E 3.0 x8
  • 8x 3.5"Hot-swap drive bays
  • M.2 Interface: 1 SATA/PCI-E 3.0 x2
  • M.2 Form Factor: 2280, 22110
  • M.2 Key: M-key
  • Dual Gigabit Ethernet LAN Ports
  • 2000W Redundant Titanium Level Certified High-Efficiency Power Supply

Pricing

Key Features

Key Features

  • Single AMD EPYC™ 7003/7002 Series Processor
  • 2TB Registered ECC DDR4 3200MHz SDRAM in 8 DIMMs
  • Up to 6 PCI-E Gen 4 x16 (4 internal, 2 external) slots, 1 PCI-E 4.0 x8 AIOM slot
  • M.2 Interface: 2 PCI-E 4.0 x4
  • M.2 Form Factor: 2280, 2210
  • M.2 Key: M-key
  • Integrated IPMI 2.0 + KVM with dedicated LAN
  • 2 front Hot-swap 2.5" U.2 NVMe Gen4 drive bays
  • AST2600 BMC
  • 2600W Redundant (1+1) Power Supplies Titanium Level (96%)

Pricing

Key Features

Key Features

  • High Density 2U System with NVIDIA® HGX™ A100 4-GPU; Highest GPU communication using NVIDIA® NVLINK™, 4 NICs for GPUDirect RDMA (1:1 GPU Ratio)
  • Supports HGX A100 4-GPU 40GB (HBM2) or 80GB (HBM2e)
  • Direct connect PCI-E Gen4 Platform with NVIDIA® NVLink™ v3.0 up to 600GB/s interconnect
  • On board BMC supports integrated IPMI 2.0 + KVM with dedicated 10G LAN
  • Dual AMD EPYC™ 7003/7002 Series Processors
  • 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
  • 4 PCI-E Gen 4 x16 (LP), 1 PCI-E Gen 4 x8 (LP)
  • 4 Hot-swap 2.5" drive bays (SAS/SATA/NVMe Hybrid)
  • 2x 2200W Platinum Level power supplies with Smart Power Redundancy

Pricing

Key Features

Key Features

  • Supports up to 8 double-width GPUs Direct connect for maximum performance
  • Dual AMD EPYC™ 7003/7002 Series Processors
  • 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
  • 9 PCI-E 4.0 x16
  • Up to 24 Hot-swap 2.5" drive bays.
  • With included hardware:
  • - 2x 2.5" SATA in RAID 1 via onboard Marvell 9230
  • - 4x 2.5" NVMe (depends on PCI-E quantity based on #4)
  • 2 GbE LAN ports (rear)
  • 8 Hot-swap 11.5K RPM cooling fans

Pricing

Key Features

  • Supports NVIDIA® HGX™ A100 8-GPU; Highest GPU communication using NVIDIA® NVLINK™ v3.0 + NVIDIA® NVSwitch™; NICs for GPUDirect RDMA (1:1 GPU Ratio)
  • Supports HGX A100 8-GPU 40GB (HBM2) or 80GB (HBM2e)
  • Dual AMD EPYC™ 7003/7002 Series Processors
  • 8TB Registered ECC DDR4 3200MHz SDRAM in 32 DIMMs
  • 8 PCI-E 4.0 x16 via PCI-E switch; 1 PCI-E 4.0 x 16 LP and 1 PCI-E 4.0 x8 LP via CPUs;
  • 6 Hot-swap U.2 NVMe 2.5" drive bays (4 via PCI-E switch, 2 via CPU)
  • Up to 10 U.2 NVMe 2.5" drives available with an optional 4 drive bays at rear of system
  • Flexible Networking via AIOM, 1 dedicated IPMI LAN Port
  • 4 Hot-swap heavy-duty cooling fans
  • 2200W (3+1) Redundant Platinum Level Power Supplies

Key Features

Pricing

Key Features

  • Supports AMD Instinct™ MI200 Series Accelerators with AMD Infinity™ Fabric™ GPU-GPU Interconnect, 1:1 GPU-to-NIC ratio
  • Supports MI250 OAM Accelerator with 128GB (HBM2e) and Infinity Interconnect
  • Supports HGX A100 4-GPU
  • Dual AMD EPYC™ 7003 Series Processors
  • 8 PCI-E 4.0 x16 via PLX
  • 2 PCI-E 4.0 x16 LP via CPUs (for 5U SKU)
  • 10 hot-swap 2.5" U.2 NVMe/SATA/SAS hybrid drive bay
  • 1 dedicated IPMI LAN Port
  • 5 hot-swap heavy-duty cooling fans

Key Features

THU GỌN

http://thenounproject.comThe Noun ProjectIcon TemplateRemindersStrokesTry to keep strokes at 4pxMinimum stroke weight is 2pxFor thicker strokes use even numbers: 6px, 8px etc.Remember to expand strokes before saving as an SVG SizeCannot be wider or taller than 100px (artboard size)Scale your icon to fill as much of the artboard as possibleUngroupIf your design has more than one shape, make sure to ungroupSave asSave as .SVG and make sure “Use Artboards” is checked100px.SVG

ANH DUC JOINT STOCK COMPANY

SYSTEM PERFORMANCE

Top choice of Workstation and Server for every business

Established in 2004 with 18 years of operation in the market of Workstation (workstation) and Server (server).

Importer and distributor of Supermicro, Nvidia, IBM, Dell, HP brands in Vietnam.

A team of technical experts with the knowledge and experience we have cultivated, in order to bring efficient equipment systems to users.

Provide solutions to integrate HPC system, high quality AI system through consulting, design, construction, to transfer and operate for businesses, scientific projects...

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HPC - Deep Learning - AI System

HPC - Deep Learning - AI System

Make sure the AI application is implemented perfectly

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ANH DUC JOINT STOCK COMPANY

Hà Nội

No. 02 Lane 11 Tay Ho, Quang An Ward, Tay Ho District, Hanoi

Tp. Hồ Chí Minh

488/15B Cong Hoa, Ward 13, Tan Binh District, Ho Chi Minh

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